IDTechEx Research Reports异质集成、AI（人工智能）、HPC（高性能计算）、数据中心、半导体封装市场预测、封装天线、2.5D封装、3D封装、扇出型封装、FOWLP（扇出型晶圆级封装）、FOPLP（扇出型面板级封装）、Si-Via（硅通孔）、玻璃封装、共封装光学元件、RDL（再分配层）、混合键合 ...

本报告对包括硅光子在内的光子集成电路行业进行了分类。报告概述了主要市场参与者、新兴材料（如薄膜铌酸锂和钛酸钡）以及关键应用（如人工智能），并据此预测硅光子和光子集成电路（PIC）市场的增长。IDTechEx还探讨了 ...

T+Ink isn't a manufacturer; it's a licensing organization. By partnering with global brands to bring our products to market, our goal is nothing less than to "T+ink" every product on the planet and to ...

Register for IDTechEx's upcoming free webinars.PFAS規制後の自動車用冷媒としてR1234yfの次に来るのは何か？

Register for IDTechEx's upcoming free webinars.AI Chips: Energy Consumption Concerns of Large AI Models, GPU Technologies, and the Shift to Custom Silicon ...

This report analyses thermal management approaches for electric vehicle batteries, motors, power electronics, and the vehicle as a whole. A deep dive is taken into OEM strategies, materials, fluids, ...

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Carbon capture, utilization, and storage (CCUS) is a set of technologies for stripping carbon dioxide from waste gases and directly from the atmosphere, before either storing it permanently ...

Key to our subscription services are our expert business and technology analysts. IDTechEx analysts have highly technical backgrounds and are well-connected in their fields, enabling them to conduct ...

Sensors continue to drive the core value proposition behind many wearable devices. This report covers 21 key types of wearable sensor (including IMUs, OHRM, depth & imaging, chemical sensors, ...

IDTechEx's report "Silicon Photonics and Photonic Integrated Circuits 2025-2035: Technologies, Market, Forecasts" categorizes the photonic integrated circuit industry, including silicon photonics. It ...